The IICIE International Integrated Circuit Innovation Expo will grandly open at the Shenzhen World Exhibition & Convention Center (Bao'an) from September 9th - 11th, 2026. As a premier industry event focusing on the entire integrated circuit industry chain, this expo brings together upstream and downstream companies to showcase cutting-edge technologies and innovative achievements in chip design, wafer manufacturing, packaging and testing, core process equipment, and key semiconductor materials. Shanghai Yangmi Intelligent Technology Co., Ltd. will be exhibiting a range of core semiconductor process equipment at booth 16B108 . We sincerely invite industry customers, experts, and colleagues to visit and exchange ideas.
Shanghai Yangmi Intelligent is a globally-oriented professional semiconductor equipment manufacturer. With years of experience in the semiconductor equipment industry, it has built a comprehensive technology R&D and talent system. Headquartered in Shanghai, the company has two major production bases in North and East China, achieving a multi-location collaborative industrial ecosystem. Leveraging its superior product performance and stable, reliable process solutions, many of its core equipment products have achieved outstanding global market share, continuously contributing to the high-quality development of China's semiconductor industry.
At this exhibition, Shanghai Yangmi Intelligent brought a complete set of core equipment for semiconductor manufacturing processes, covering key process links such as wafer bonding, glue spraying and homogenization, cleaning and brushing, high-temperature bonding, and SiC ultrasonic processing.
✅The fully automatic seed crystal bonding machine integrates wafer coating, bonding, bubble removal and bonding into a fully automatic operation. It is compatible with a variety of wafer and substrate materials, ensures bonding concentricity, and meets the requirements of high-precision bonding processes.
✅The fully automatic cleaning machine is designed for high-volume production lines and supports single-wafer cleaning processes. It can be equipped with high-pressure, two-fluid, megohmmic, and brush modules as needed to adapt to cleaning conditions of particles of different sizes.
✅ Fully automatic glue spraying machine/spreading machine is suitable for deep hole TSV, high aspect ratio stepped glue spraying and curing processes; the spreading equipment realizes vacuum spin coating and automatic glue dispensing, with precise and controllable film thickness, providing professional coating solutions for semiconductor substrates.
✅The high-temperature bonding hot press furnace is equipped with a high-precision temperature control, pressure and vacuum control system, which enables uniform high-temperature bonding of various substrate materials and has strong process stability.
✅ Solid SiC ultrasonic processing equipment addresses the pain points in silicon carbide material processing, effectively improving issues such as edge chipping and micro-cracks, with hole edge chipping ≤0.03mm; processing efficiency and tool life are significantly improved, reducing tool usage costs; micro-hole diameter fluctuations are controllable, and stepped blind holes can be formed in one step, meeting the stringent quality requirements of semiconductor high-purity gas spray components.
The semiconductor industry is at a critical juncture of rapid iteration, with material innovation and equipment localization being the core driving forces for its development. Shanghai Yangmi, with a global perspective, deeply cultivates the entire semiconductor industry chain, adheres to technological breakthroughs and product innovation, and is committed to providing the industry with stable, efficient, and domestically produced process equipment and overall solutions, contributing to the self-reliance and controllability of the semiconductor manufacturing industry chain.
