Industry-leading equipment solutions covering the full semiconductor manufacturing chain — from SiC seed crystal bonding to precision ultrasonic machining.
Solid SiC ultrasonic processing equipment: solves material stress-induced chipping, eliminates subsurface microcracks, reduces hole chipping to ≤0.03mm, increases processing efficiency by 40%~150%, extends PCD drill bit life by 100%~160%, halves the cost per tool, and ensures hole diameter fluctuation of ≤
View Details →Contact our team for equipment consultation, technical specifications, or a custom solution proposal tailored to your production needs.