Industry-leading equipment solutions covering the full semiconductor manufacturing chain — from SiC seed crystal bonding to precision ultrasonic machining.
Solid SiC ultrasonic processing equipment: solves material stress-induced chipping, eliminates subsurface microcracks, reduces hole chipping to ≤0.03mm, increases processing efficiency by 40%~150%, extends PCD drill bit life by 100%~160%, halves the cost per tool, and ensures hole diameter fluctuation of ≤
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High-temperature bonding hot press furnace: It adopts a precise temperature control, pressure and vacuum control system to achieve uniform high-temperature bonding of various substrate materials.
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Automatic glue spraying/spreading: The fully automatic glue spraying machine can spray glue on substrate materials of various shapes. It is suitable for deep hole TSV spraying, high aspect ratio step spraying, and curing process. The fully automatic spreader can prepare various circular substrate ma
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Automatic cleaning machine/brush washing machine: Suitable for high-volume production lines with high capacity requirements, it can realize various single-wafer cleaning processes. High pressure, two-fluid, megohmonic and PVA brush configurations can be selected according to customer process require
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It integrates wafer coating, bonding, and bubble removal bonding in a fully automated manner, realizing bonding and bonding of various wafer substrate materials, and ensuring bonding concentricity.
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