FAQ

Shanghai Yangmi Intelligent Technology Co., Ltd. is a professional semiconductor equipment manufacturer. Our core product portfolio includes automatic SiC seed crystal bonding machines, spray coating machines / spin coaters, wafer cleaning and scrubbing systems, high-temperature bonding hot press furnaces, and Solid SiC ultrasonic machining equipment. We hold over 90% of global market share in key equipment segments and serve semiconductor fabs in 30+ countries.

We serve the full semiconductor industry chain, including power semiconductors (SiC and GaN device manufacturing), MEMS & sensors, IC manufacturing, advanced packaging, optoelectronics (LED / OLED / QLED), and RF & aerospace applications. Our equipment is used wherever precision wafer processing, coating, cleaning, or SiC machining is required.

Yes. With our vertically integrated capabilities — 32 R&D designers, 80 production engineers, and our own semiconductor industrial park — we provide fully customized equipment solutions tailored to your specific wafer materials, process requirements, and production volumes. Our team works closely with clients from initial consultation through design, manufacturing, and commissioning.

We provide comprehensive after-sales support including equipment installation and commissioning, operator training, preventive maintenance programs, spare parts supply, and remote technical assistance. Our global service network covers 30+ countries, and our dedicated support team ensures minimal downtime for your production lines.

You can request a product demo by contacting our team via email at kenny@zgymzn.com or by calling +86 13166066030. Alternatively, visit our Contact page and submit an inquiry form. Our team will respond within 24 hours to arrange a demo at our Shanghai headquarters, Jiangsu R&D center, or at your facility.