The 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026) was recently held at the PACIFICO Yokohama International Convention Center in Yokohama, Japan, from September 28th to October 2nd, 2026. As a prestigious academic and industrial event with a long history and high influence in the global third-generation semiconductor silicon carbide field, ICSCRM brings together top research institutions, leading companies in the industry chain, industry experts, and technical engineers from around the world to discuss cutting-edge technologies in silicon carbide crystal growth, wafer manufacturing, and equipment processes. Our company showcased our core SiC seed bonding equipment at the exhibition, demonstrating the robust capabilities of domestically produced SiC equipment to global customers.
ICSCRM is a benchmark international conference in the silicon carbide industry. This exhibition has attracted a host of leading international companies as sponsors, including RESONAC , ASM, ROHM , Wolfspeed, AIXTRON , SICC , and TANKEBLUE , covering the entire silicon carbide industry chain. The exhibition features academic forums and company product booths, balancing the release of cutting-edge academic findings with the exchange of industrial equipment and technologies, making it one of the most important platforms for global SiC industry technology matchmaking and business negotiations.
At this exhibition, our company highlighted our fully automated SiC seed bonding equipment. This equipment boasts a global market share exceeding 90%. The conference showcased a complete solution encompassing automated seed bonding , low-temperature bonding, and high-temperature bonding . Utilizing mature adhesive spraying technology, the equipment reliably completes the bonding process between graphite plates, graphite paper, and seed crystals, effectively improving the yield and quality of silicon carbide crystal growth . It is a core piece of equipment in the large-size SiC crystal fabrication process. At the booth, overseas customers and industry experts flocked to the site. Our team members provided detailed explanations of the equipment's principles, process advantages, and practical application cases, engaging in in-depth technical exchanges with visiting international clients on topics such as pain points in large-size crystal growth processes, equipment localization, and overseas project implementation.
Inside the conference and exchange venue, industry colleagues from all over the world gathered to exchange ideas on the development trends of the silicon carbide industry and the next-generation crystal technology roadmap. This exhibition not only served as an important showcase of our company's core equipment to the international market, but also helped the team gain a close understanding of the latest technological iterations in the global SiC industry and the real needs of overseas customers, building a communication bridge for cross-border technological cooperation.
Inside the conference and exchange venue, industry colleagues from all over the world gathered to exchange ideas on the development trends of the silicon carbide industry and the next-generation crystal technology roadmap. This exhibition not only served as an important showcase of our company's core equipment to the international market, but also helped the team gain a close understanding of the latest technological iterations in the global SiC industry and the real needs of overseas customers, building a communication bridge for cross-border technological cooperation.
The global silicon carbide (SiC) industry is currently experiencing rapid growth, and large-size crystals are the core foundation of the power semiconductor industry. Looking ahead, we will continue to focus on the SiC crystal growth equipment sector, adhere to technological innovation, continuously optimize the performance of seed crystal bonding equipment, and continuously expand into the global market. We will provide stable and efficient domestically produced equipment solutions for SiC wafer manufacturers both domestically and internationally, contributing to the high-quality development of the third-generation semiconductor industry.
