Solid SiC ultrasonic processing equipment: solves material stress-induced chipping, eliminates subsurface microcracks, reduces hole chipping to ≤0.03mm, increases processing efficiency by 40%~150%, extends PCD drill bit life by 100%~160%, halves the cost per tool, and ensures hole diameter fluctuation of ≤±3μm for thousands of micro-holes on the same tray. Uniform and stable airflow is key to high-quality etching machines. It is compatible with mainstream stepped blind hole spray heads of various sizes, enabling one-step ultrasonic forming without secondary processing. It meets the high-purity gas spray requirements for semiconductors (cracks can trap impurities and contaminate wafers).