Automatic cleaning machine/brush washing machine: Suitable for high-volume production lines with high capacity requirements, it can realize various single-wafer cleaning processes. High pressure, two-fluid, megohmonic and PVA brush configurations can be selected according to customer process require
Technical specifications, key features, and application details for Automatic cleaning_scrubbing_bonding
Automatic cleaning machine/brush washing machine: Suitable for high-volume production lines with high capacity requirements, it can realize various single-wafer cleaning processes. High pressure, two-fluid, megohmonic and PVA brush configurations can be selected according to customer process requirements to meet the cleaning needs of particles of different sizes.
Solid SiC ultrasonic processing equipment: solves material stress-induced chipping, eliminates subsurface microcracks, reduces hole chipping to ≤0.03mm, increases processing efficiency by 40%~150%, extends PCD drill bit life by 100%~160%, halves the cost per tool, and ensures hole diameter fluctuation of ≤
Learn More →Contact our team for equipment consultation, technical specifications, or a custom solution proposal tailored to your production needs.